Photovoltaic Module Solution
650V / 1000V / 1200V IGBTs optimized for PV applications, featuring ultra-low static and dynamic losses for higher system efficiency.
2000V SiC BOOST devices that simplify MPPT design and improve overall efficiency.
Enhanced Easy3B and Easy2B packages with customized pin layouts, supporting diverse PV string configurations and high-temperature operation up to 175 °C.
High device consistency and excellent current sharing, enabling reliable parallel operation and easy system scaling.
Optimized solutions tailored to application and overload requirements, including package and chip configuration customization.




Introduction to the PV Module Series Solution
Adopting high-eficiency trench field stop IGBTs andplanar-gate SiC MOSFETs combined with high-reliabilityEasy2B /Easy 3B/62mm packages, the products can enhance theenergy conversion efficiency of photovoltaic power plants andimprove system reliability, covering the whole range of stringand centralised photovoltaic system.
IGBT Product List

DC/AC Grid Interconnection NPC1

DC/AC Grid Interconnection ANPC

DC/AC Grid Interconnection NPC2
| Product model | chip Types | Ic(A)@25℃ | Topology | Rated(V) | Packaging |
|---|---|---|---|---|---|
| HCG600FL120E3T1 | Hybrid | 600 | 3-level | 1200 | Econo Dual 3A |
| HCG600FL110E3T1 | Hybrid | 600 | 3-level | 1100 | Econo Dual 3A |
| HCS600FH120M2 | SiC | 600 | Half Bridge | 1200 | Econo Dual 3A |
| HCS450FH120M2 | SiC | 450 | Half Bridge | 1200 | Econo Dual 3A |
| HCS670FH120M2 | SiC | 670 | Half Bridge | 1200 | Econo Dual 3A |
| HCS450FH220M | SiC | 450 | Half Bridge | 2200 | Econo Dual 3A |
| HCS600FH220M | SiC | 600 | Half Bridge | 2200 | Econo Dual 3A |
| HCS300FH120M | SiC | 300 | Half Bridge | 1200 | Econo Dual 3A |
| HCS600FH120D5B3 | SiC | 600 | Half Bridge | 1200 | Econo Dual3C |
| HCS05FH120E1R1 | SiC | 150 | Half Bridge | 1200 | Easy 1B |
| HCS10FH120E1A2 | SiC | 100 | Half Bridge | 1200 | Easy 1B |
| HCS30FF120E1A1 | SiC | 45 | H-Bridge | 1200 | Easy 1B |
| HCS400FH120BG | SiC | 400 | Half Bridge | 1200 | Easy 1B |
SiC Product List

DC/AC Grid Interconnection NPC1

DC/AC Grid Interconnection ANPC

DC/AC Grid Interconnection NPC2
| Product model | chip Types | Ic(A)@25℃ | Topology | Rated(V) | Packaging |
|---|---|---|---|---|---|
| HCS06FH120E2C1 | SiC | 200 | Half Bridge | 1200 | Easy2B |
| HCS08FH120E2A2 | SiC | 160 | Half Bridge | 1200 | Easy2B |
| HCH10FA120E2C1 | Hybrid | 100 | ANPC | 1200 | Easy2B |
| HCS04FC120E2C2 | SiC | 200 | Chopper | 1200 | Easy2B |
| HCS05FH230E2B2 | SiC | 240 | Half Bridge | 2300 | Easy 2B |
| HCS240FH120E2DM | SiC | 240 | Half Bridge | 1200 | Easy2B |
| HCS350FH200E3 | SiC | 350 | Half Bridge | 2000 | Easy 3B |
| HCS600FL120E3T1 | SiC | 600 | 3-level | 1200 | Easy 3B |
| HCS320FH120A2M | SiC | 320 | Half Bridge | 1200 | 62mm |
| HCS350FH120A2M | SiC | 350 | Half Bridge | 1200 | 62mm |
| HCS360FH120A2C1 | SiC | 360 | Half Bridge | 1200 | 62mm |
| HCS400FH120A2BM | SiC | 400 | Half Bridge | 1200 | 62mm |
| HCS540FH120A2A1 | SiC | 540 | Half Bridge | 1200 | 62mm |
| HCS300FH170A2C1 | SiC | 300 | Half Bridge | 1700 | 62mm |
| HCS400FH170A2C1 | SiC | 400 | Half Bridge | 1700 | 62mm |
| HCS68FS120ST | SiC | 68 | Single sw itch | 1200 | SOT-227 |
| HCS120FS120ST | SiC | 120 | Single sw itch | 1200 | SOT-227 |
PV-Oriented Device & Topology Optimization
From semiconductor structure to system topology, every detail is optimized for photovoltaic operating conditions.
PV-specific voltage platforms
Dedicated voltage classes of 650V / 1000V / 1200V / 1700V / 2200V align with mainstream and next-generation PV DC bus designs, including 1500V systems.
Ultra-low switching and conduction losses
Trench-field-stop IGBTs and planar-gate SiC MOSFETs significantly reduce both dynamic and static losses, improving inverter efficiency and lowering thermal stress.
Native support for PV topologies
Optimized for Boost, Dual Boost, FC Boost, NPC, ANPC, 3-Level, and Half-Bridge topologies commonly used in PV inverters and DC/DC stages.
Designed for harsh outdoor environments
High junction temperature capability (up to 175°C) ensures stable operation under high ambient temperatures and long service life.
Build Your Next PV System with HIITIO
Get expert support to select the right IGBT or SiC module for your PV application.
System-Oriented Power Semiconductor Expertise
Beyond individual devices, HIITIO delivers system-oriented power semiconductor solutions for real-world energy conversion applications.
Application-focused power semiconductor development
Focus on real-world application scenarios rather than isolated device performance, with long-term involvement in renewable energy, power electronics, and industrial power systems.
Comprehensive voltage and packaging portfolio
Full coverage from discrete devices to integrated power modules, supporting voltage classes from 650V to 2200V and multiple industry-standard packages for different power levels.
Topology- and application-based product selection
Support device and module selection based on system topology, DC bus voltage, current rating, switching frequency, and thermal requirements.
Designed for scalability and long-term reliability
Products and platforms are structured to support parallel operation, power scaling, and stable long-term operation in demanding environments.
Application Scenarios
Covering key energy conversion stages in photovoltaic and PV-plus-storage systems.

PV Inverters

DC/DC Boost Converters

Grid-Connected Converters

PV+Energy Storage Systems
PV Module Series Solution FAQs
Frequently Asked Questions on Photovoltaic Power Module Selection
How should I select between IGBT and SiC modules for photovoltaic applications?
IGBT is recommended for medium-to-low frequency, high-power systems; SiC is preferred for high-frequency, high-efficiency systems.
Do you support 1500V photovoltaic systems?
Yes, we provide SiC module solutions for 1700V and higher voltage levels.
Do you support parallel expansion?
Yes, multiple modules are suitable for parallel operation and power scaling.
Can you provide custom packaging or parameters?
Customization support at the device and packaging levels is available based on project requirements.
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