3300V 1500A lGBT Module H Package with FWD

  • Enhanced Current Rating: 1500A DC collector current for higher power density
  • Low Conduction Losses: Optimized VCE(sat) characteristics (2.45V-3.80V)
  • High Robustness: Advanced chip design for exceptional reliability
  • Thermal Excellence: 150°C junction operating temperature capability
  • Integrated FWD: Built-in freewheeling diode for a complete power switching solution

Description

The HCG1500S330H2K1 represents the next generation of power semiconductor technology, offering superior performance in a compact H package. This module is engineered for the most demanding power conversion applications.

Maximum Rated Values

ParameterSymbolConditionsValueUnit
Collector-Emitter VoltageVCESVGE=0V,Tvj=25℃3300V
DC Collector CurrentlcTc=100℃,Tvj=150℃1500A
Peak Collector CurrentCMtp=1ms3000A
Gate-Emitter VoltageVGES±20V
Total Power DissipationPtotTc=25°℃,Tvj=150℃16kW
DC Forward CurrentIF1500A
Peak Forward CurrentIFRMtp=1ms3000A
Surge CurrentIFSMVR=0V,Tvj=150℃,

tp=10ms,half-sinewave

13500A
IGBT Short Circuit SOAtpscVcc=2500V,VCEM CHIP≤3300V
VGE≤15V,Tvj≤150℃
10μs
Maximum Junction TemperatureTvj(max)150
Junction Operating TemperatureTv(op)-40~150
Case temperatureTc-40~150
Storage TemperatureTstg-40~125

Additional information

Module

IGBT

Package

H

Blocking Voltage (V)

3300

Module Current (A)

1500

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