3300V 1500A lGBT Module H Package with FWD

  • Enhanced Current Rating: 1500A DC collector current for higher power density
  • Low Conduction Losses: Optimized VCE(sat) characteristics (2.45V-3.80V)
  • High Robustness: Advanced chip design for exceptional reliability
  • Thermal Excellence: 150°C junction operating temperature capability
  • Integrated FWD: Built-in freewheeling diode for a complete power switching solution

Description

The HCG1500S330H2K1 represents the next generation of power semiconductor technology, offering superior performance in a compact H package. This module is engineered for the most demanding power conversion applications.

Maximum Rated Values

Parameter Symbol Conditions Value Unit
Collector-Emitter Voltage VCES VGE=0V,Tvj=25℃ 3300 V
DC Collector Current lc Tc=100℃,Tvj=150℃ 1500 A
Peak Collector Current CM tp=1ms 3000 A
Gate-Emitter Voltage VGES ±20 V
Total Power Dissipation Ptot Tc=25°℃,Tvj=150℃ 16 kW
DC Forward Current IF 1500 A
Peak Forward Current IFRM tp=1ms 3000 A
Surge Current IFSM VR=0V,Tvj=150℃,

tp=10ms,half-sinewave

13500 A
IGBT Short Circuit SOA tpsc Vcc=2500V,VCEM CHIP≤3300V
VGE≤15V,Tvj≤150℃
10 μs
Maximum Junction Temperature Tvj(max) 150
Junction Operating Temperature Tv(op) -40~150
Case temperature Tc -40~150
Storage Temperature Tstg -40~125

Additional information

Module

IGBT

Package

H

Blocking Voltage (V)

3300

Module Current (A)

1500

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