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- High current density,industry-leading operating conditions
- Low conduction and switching losses for higher outgoing currents
- Low stray inductance design to avoid oscillation, low thermal resistance design
- Substrates, backplanes, housings, etc. can be customized to meet customer’s diverse power requirements
Introduction to the Automotive Grade SiC Module Series
The encapsulation and plastic packaging series products developed by using the high-performance planar gate SiC MOSFET chips from Xilian, cover the entire range from 750V to 1200V. They feature high current density, low switching loss, and high short-circuit capability, and can meet the high reliability power modules for complex automotive working conditions.
| Product model | chip Types | Ic(A)@25℃ | Topology | Rated(V) | Packaging |
|---|---|---|---|---|---|
| HCS900FH120D3C1 | Sic | 900 | Half Bridge | 1200 | Econo Dual 3A |
| HCS600FH120D3M | SiC | 600 | Half Bridge | 1200 | Econo Dual 3A |
| HCS450FH120M2 | Sic | 450 | Half Bridge | 1200 | Econo Dual 3A |
| HCS300FH120D3C1 | SiC | 300 | Half Bridge | 1200 | Econo Dual 3A |
| HCS800FH170D3C1 | SiC | 800 | Half Bridge | 1700 | Econo Dual 3A |
| HCS600FH170D3C1 | SiC | 600 | Half Bridge | 1700 | Econo Dual 3A |
| HCS450FH170D3C1 | Sic | 450 | Half Bridge | 1700 | Econo Dual 3A |
| HCS300FH170D3C1 | SiC | 300 | Half Bridge | 1700 | Econo Dual 3A |
| HCS450FH220D3M | Sic | 450 | Half Bridge | 2200 | Econo Dual 3A |
| HCS600FH220D3M | SiC | 600 | Half Bridge | 2200 | Econo Dual 3A |
| HCS600FH120D4C2 | SiC | 600 | Half Bridge | 1200 | Econo Dual3B |
| HCS400FH120D4C2 | Sic | 400 | Half Bridge | 1200 | Econo Dual3B |
| HCS300FH120D4C2 | Sic | 300 | Half Bridge | 1200 | Econo Dual3B |
| HCS400FC120D4C2 | SiC | 400 | Chopper | 1200 | Econo Dual3B |
| HCS400FC170D4C2 | Sic | 400 | Chopper | 1700 | Econo Dual3B |
| HCS600FH120D5B3 | SiC | 600 | Half Bridge | 1200 | Econo Dual3C |
Planar Gate SiC MOSFET for Efficiency
A proven chip structure balancing switching speed and conduction loss, ensuring stable dynamic performance even under high-frequency operation.
Ultra-Low Stray Inductance Package
Optimized current paths suppress voltage overshoot and ringing, reducing EMI while improving switching quality and system safety margin.
High Current Density in Compact Size
Deliver more power from a smaller footprint, enabling compact, lightweight, and highly integrated inverter designs.
Higher Efficiency at System Level
Lower switching and conduction loss reduces cooling demand while increasing vehicle driving range and energy utilization.
Need a Custom SiC Module Solution?
Tell us your system requirements — we deliver the optimized module
Superior Thermal & Short-Circuit Capability
Engineered for high-temperature environments and mission-profile-based reliability
Low Thermal Resistance Structure
Multi-layer thermal path enables fast heat extraction, reducing temperature rise and sustaining higher power output.
High Junction Temperature Capability
Operates at higher junction temperatures while maintaining electrical performance and long-term reliability.
Robust Short-Circuit Withstand Capability
Provides longer protection response time during fault conditions, increasing system safety margin.
Extended Power Cycling Lifetime
Enhanced material matching improves resistance to thermo-mechanical stress, meeting automotive lifetime expectations.
Your Trusted SiC Module Partner
HIITIO is an engineering-driven power semiconductor manufacturer specializing in IGBT module design for demanding industrial and renewable energy applications.
With strong in-house capabilities covering chip selection, module packaging, thermal optimization, and reliability validation, HIITIO delivers products engineered for long-term operation under harsh electrical and environmental conditions.
- In-house Module Packaging Manufacturing
- Comprehensive Reliability Testing Capability
- Flexible Topology & Platform Coverage
- Fast Customization for OEM & Platform Projects
Application Scenarios
Designed for next-generation electric drivetrain architectures
EV Traction Inverter
E-axle for commercial vehicles
High-voltage performance platforms
Bidirectional power conversion systems
Common questions about HIITIO Wind Power IGBT Modules
What voltage platforms are supported?
The module supports 750V, 800V, 1000V and higher voltage platforms for both passenger and commercial EV drivetrains, with customization available for special voltage requirements.
What are the key advantages over conventional IGBT modules?
SiC modules deliver lower switching and conduction loss, enabling higher efficiency, reduced cooling size, increased power density, and extended driving range.
Is the module qualified for automotive reliability standards?
The module is designed and validated under mission-profile conditions including power cycling, thermal shock, short-circuit, and HTRB tests for long-term drivetrain operation.
Do you provide engineering support during the design-in phase?
HIITIO provides full application support including loss simulation, thermal design guidance, gate driver matching, and busbar parasitic optimization.
How do you ensure production capacity and delivery stability?
With in-house packaging lines and a mature supply chain, we ensure fast ramp-up from prototyping to mass production and long-term delivery stability.
How can I request datasheets, samples, or technical support?
You can contact HIITIO directly through the inquiry form to request datasheets, samples, or engineering support for your wind power project.
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Get optimized SiC modules engineered for efficiency reliability and fast system integration support
HIITIO is a global provider of power semiconductor solutions for new energy mobility and clean power systems, focusing on the development and manufacturing of high-performance power modules. With strong in-house capabilities in chip selection, packaging process development, thermal optimization, and reliability validation, we deliver SiC modules engineered for long-term operation under high-frequency, high-temperature, and high-power-density conditions.
Tailored module selection
Loss & efficiency estimation
Thermal design guidance
20 Years of Expertise
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