{"id":5868,"date":"2026-07-24T06:07:00","date_gmt":"2026-07-24T06:07:00","guid":{"rendered":"https:\/\/www.hiitiosemi.com\/?p=5868"},"modified":"2026-07-24T06:07:03","modified_gmt":"2026-07-24T06:07:03","slug":"what-strategic-view-need-to-know-about-press-pack-igbt-in-2026","status":"publish","type":"post","link":"https:\/\/www.hiitiosemi.com\/zh\/blog\/what-strategic-view-need-to-know-about-press-pack-igbt-in-2026\/","title":{"rendered":"What Strategic View Need to Know About Press-Pack IGBT in 2026"},"content":{"rendered":"<p class=\"wp-block-paragraph\">What Strategic View Need to Know About press-pack IGBT in 2026&nbsp;\u2014 If you\u2019re a utility executive, grid planner, or power-electronics strategist, consider this your concise briefing: the battle for long-term uptime will center on&nbsp;press-pack IGBT&nbsp;reliability, adoption of higher-voltage platforms (5.2\u20136.5 kV),&nbsp;bond-wire-free&nbsp;failure modes, and&nbsp;double-sided cooling&nbsp;to enable denser, more serviceable VSC-HVDC and offshore-wind converters. <\/p>\n\n\n\n<div class=\"wp-block-columns is-layout-flex wp-container-core-columns-is-layout-995f960e wp-block-columns-is-layout-flex\">\n<div class=\"wp-block-column is-layout-flow wp-block-column-is-layout-flow\">\n<figure class=\"wp-block-image size-large\"><img fetchpriority=\"high\" decoding=\"async\" width=\"1024\" height=\"1024\" src=\"https:\/\/www.hiitiosemi.com\/wp-content\/uploads\/2025\/11\/Presspack_Igbt_9-1024x1024.webp\" alt=\"\" class=\"wp-image-3511\" srcset=\"https:\/\/hiitiosemi.b-cdn.net\/wp-content\/uploads\/2025\/11\/Presspack_Igbt_9-1024x1024.webp 1024w, https:\/\/hiitiosemi.b-cdn.net\/wp-content\/uploads\/2025\/11\/Presspack_Igbt_9-300x300.webp 300w, https:\/\/hiitiosemi.b-cdn.net\/wp-content\/uploads\/2025\/11\/Presspack_Igbt_9-150x150.webp 150w, https:\/\/hiitiosemi.b-cdn.net\/wp-content\/uploads\/2025\/11\/Presspack_Igbt_9-768x768.webp 768w, https:\/\/hiitiosemi.b-cdn.net\/wp-content\/uploads\/2025\/11\/Presspack_Igbt_9-500x500.webp 500w, https:\/\/hiitiosemi.b-cdn.net\/wp-content\/uploads\/2025\/11\/Presspack_Igbt_9-600x600.webp 600w, https:\/\/hiitiosemi.b-cdn.net\/wp-content\/uploads\/2025\/11\/Presspack_Igbt_9-100x100.webp 100w, https:\/\/hiitiosemi.b-cdn.net\/wp-content\/uploads\/2025\/11\/Presspack_Igbt_9.webp 1102w\" sizes=\"(max-width: 1024px) 100vw, 1024px\" \/><\/figure>\n<\/div>\n\n\n\n<div class=\"wp-block-column is-layout-flow wp-block-column-is-layout-flow\">\n<figure class=\"wp-block-image size-full\"><img decoding=\"async\" width=\"600\" height=\"600\" src=\"https:\/\/www.hiitiosemi.com\/wp-content\/uploads\/2025\/10\/Presspack-Igbt-8.webp\" alt=\"\" class=\"wp-image-1691\" srcset=\"https:\/\/hiitiosemi.b-cdn.net\/wp-content\/uploads\/2025\/10\/Presspack-Igbt-8.webp 600w, https:\/\/hiitiosemi.b-cdn.net\/wp-content\/uploads\/2025\/10\/Presspack-Igbt-8-300x300.webp 300w, https:\/\/hiitiosemi.b-cdn.net\/wp-content\/uploads\/2025\/10\/Presspack-Igbt-8-100x100.webp 100w, https:\/\/hiitiosemi.b-cdn.net\/wp-content\/uploads\/2025\/10\/Presspack-Igbt-8-500x500.webp 500w, https:\/\/hiitiosemi.b-cdn.net\/wp-content\/uploads\/2025\/10\/Presspack-Igbt-8-150x150.webp 150w\" sizes=\"(max-width: 600px) 100vw, 600px\" \/><\/figure>\n<\/div>\n<\/div>\n\n\n\n<p class=\"wp-block-paragraph\">Expect vendor consolidation, tight qualification cycles, and mounting pressure from grid modernization needs \u2014 driven by&nbsp;UHV\/HVDC, massive electrification (including&nbsp;AI data centers), and SiC competition \u2014 all of which will shape procurement, capex, and risk choices going into 2026.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Executive Summary<\/h2>\n\n\n\n<h3 class=\"wp-block-heading\">2026 Grid Pressure<\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Power systems are facing tighter operating margins as&nbsp;renewable energy grid integration,&nbsp;HVDC transmission, and&nbsp;critical backup power&nbsp;all demand higher voltage, higher reliability, and better thermal stability.<\/li>\n\n\n\n<li>In this environment,&nbsp;press-pack IGBT&nbsp;technology matters because it supports utility-scale power conversion where failure tolerance, thermal cycling reliability, and stable performance are non-negotiable.<\/li>\n\n\n\n<li>For engineers and procurement teams, the real issue is not just device ratings. It is&nbsp;system availability,&nbsp;footprint compatibility, and&nbsp;supply continuity.<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\">Why Press-Pack IGBT<\/h3>\n\n\n\n<figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><thead><tr><th>Strategic Need<\/th><th>Why Press-Pack IGBT Fits<\/th><\/tr><\/thead><tbody><tr><td>High-voltage infrastructure<\/td><td>Suited to demanding power conversion in grid and industrial systems<\/td><\/tr><tr><td>Reliability under stress<\/td><td>Built for harsh electrical and environmental conditions<\/td><\/tr><tr><td>Thermal control<\/td><td>Helps manage heat in high-power-density designs<\/td><\/tr><tr><td>Procurement flexibility<\/td><td>Supports second-sourcing and pin-compatible replacement strategies<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<h3 class=\"wp-block-heading\">HIITIO Perspective<\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li>HIITIO is positioned as a&nbsp;semiconductor power module manufacturer&nbsp;with a focus on&nbsp;high-voltage DC power devices&nbsp;and power modules for grid, energy, and industrial applications.<\/li>\n\n\n\n<li>The value for buyers is practical:&nbsp;in-house manufacturing control,&nbsp;custom power module design,&nbsp;pin-compatible OEM swaps, and&nbsp;engineering recommendations within 24 hours.<\/li>\n\n\n\n<li>HIITIO\u2019s product range includes&nbsp;press-pack IGBTs,&nbsp;high-voltage IGBT modules,&nbsp;SiC devices, and&nbsp;IGBT\/SiC drivers, which gives system teams more room to balance performance, footprint, and sourcing risk.<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\">\u5e95\u7ebf<\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li>The strategic case for&nbsp;press-pack IGBT&nbsp;in 2026 is simple: it helps power dense, high-reliability infrastructure without forcing a redesign every time the supply chain shifts.<\/li>\n\n\n\n<li>For teams working on&nbsp;power grid infrastructure,&nbsp;renewables,&nbsp;rail traction systems,&nbsp;UPS, or&nbsp;industrial motor drives, the priority is clear: select devices that protect uptime, simplify integration, and reduce PCB re-spin risk.<\/li>\n<\/ul>\n\n\n\n<h2 class=\"wp-block-heading\">Mechanical vs. Electrical Superiority: The Architecture of Press-Pack IGBTs<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">Press-pack IGBTs stand out by eliminating the traditional weak link of bond-wire packaging. Their bond-wire-free, pressure-contact design ensures robust electrical connections that resist mechanical fatigue and reduce failure risks common in wire-bond modules. This architecture delivers superior reliability under high current and high-voltage stress, critical for demanding power grid infrastructure and industrial applications.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">A key advantage is the Short Circuit Failure Mode (SCFM), which offers a safe and predictable failure path. Unlike catastrophic ruptures seen in conventional modules, SCFM prevents sudden device destruction, enhancing system safety and uptime in HVDC transmission and STATCOM deployments.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Thermal management is another strength: double-sided cooling capabilities enable efficient heat dissipation from both sides of the module. This design effectively handles cyclical thermal stress, improving thermal cycling reliability and supporting high-power density semiconductor operation. For deeper insights into thermal management strategies, see our detailed guide on&nbsp;<a href=\"https:\/\/www.hiitiosemi.com\/blog\/thermal-design-and-cooling-solutions-for-new-energy-inverters-explained\/\">\u65b0\u80fd\u9006\u53d8\u5668\u7684\u70ed\u8bbe\u8ba1\u4e0e\u51b7\u5374\u89e3\u51b3\u65b9\u6848<\/a>.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Core Strategic Drivers &amp; Market Drivers for 2026<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">The expansion of HVDC transmission and FACTS (Flexible AC Transmission Systems) is a primary driver for press-pack IGBT adoption, with global utility deployments expected to grow at approximately 14\u201315% CAGR through 2032. This growth is fueled by the need for high-capacity, reliable power transfer across borders and renewables integration, making press-pack IGBTs essential for high-voltage grid infrastructure.<\/p>\n\n\n\n<figure class=\"wp-block-image size-large\"><img decoding=\"async\" width=\"1024\" height=\"576\" src=\"https:\/\/www.hiitiosemi.com\/wp-content\/uploads\/2026\/01\/press-pack-IGBT-application-1024x576.webp\" alt=\"\" class=\"wp-image-4461\" srcset=\"https:\/\/hiitiosemi.b-cdn.net\/wp-content\/uploads\/2026\/01\/press-pack-IGBT-application-1024x576.webp 1024w, https:\/\/hiitiosemi.b-cdn.net\/wp-content\/uploads\/2026\/01\/press-pack-IGBT-application-300x169.webp 300w, https:\/\/hiitiosemi.b-cdn.net\/wp-content\/uploads\/2026\/01\/press-pack-IGBT-application-768x432.webp 768w, https:\/\/hiitiosemi.b-cdn.net\/wp-content\/uploads\/2026\/01\/press-pack-IGBT-application-1536x864.webp 1536w, https:\/\/hiitiosemi.b-cdn.net\/wp-content\/uploads\/2026\/01\/press-pack-IGBT-application-18x10.webp 18w, https:\/\/hiitiosemi.b-cdn.net\/wp-content\/uploads\/2026\/01\/press-pack-IGBT-application-600x338.webp 600w, https:\/\/hiitiosemi.b-cdn.net\/wp-content\/uploads\/2026\/01\/press-pack-IGBT-application.webp 1820w\" sizes=\"(max-width: 1024px) 100vw, 1024px\" \/><\/figure>\n\n\n\n<p class=\"wp-block-paragraph\">A significant shift is underway toward higher voltage platforms, moving from traditional 4.5 kV to 5.2 kV and 6.5 kV systems. This transition enhances efficiency and power density, reducing losses in power conversion systems like Voltage Source Converters (VSC) and HVDC links. Such platforms are critical for supporting the increasing complexity and capacity demands of modern energy networks.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Industrial mobility and critical power applications also drive press-pack IGBT demand. Rail traction systems, including locomotives and metros, rely on these modules for their robustness and thermal performance, ensuring operational reliability in demanding environments. Similarly, industrial motor drives benefit from the high power density and thermal cycling reliability that press-pack IGBTs offer, supporting the push toward electrification and automation.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">These core and market drivers underscore the strategic importance of press-pack IGBTs in enabling a resilient, efficient, and scalable power grid in 2026 and beyond.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Supply Chain Vulnerabilities &amp; Technical Risk Mitigation<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">The high barrier to market entry in press-pack IGBT production stems from a consolidated supply landscape dominated by legacy semiconductor manufacturers. This limits options for power electronics procurement and increases risks tied to single-source dependency.<\/p>\n\n\n\n<figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><thead><tr><th>\u6311\u6218<\/th><th>\uff0c\u5c06\u529f\u7387\u5f00\u5173\u548c\u95e8\u9a71\u52a8\u5668\u7ed3\u5408\u5728\u4e00\u8d77\uff0c\u5177\u6709\u5185\u7f6e\u4fdd\u62a4\u548c\u8bca\u65ad\u529f\u80fd\u3002<\/th><\/tr><\/thead><tbody><tr><td>Consolidated supply landscape<\/td><td>Limited supplier diversity, higher costs<\/td><\/tr><tr><td>Proprietary footprints<\/td><td>Long qualification cycles, redesign risks<\/td><\/tr><tr><td>Single-source lock-in<\/td><td>Supply interruptions, lack of flexibility<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<p class=\"wp-block-paragraph\">Single-source lock-in is especially risky due to proprietary module footprints that force lengthy qualification and costly PCB re-spins if switching vendors. This creates vulnerability in high-power grid infrastructure projects where uptime and reliability are critical.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">HIITIO addresses these challenges with a strategic focus on pin-compatible OEM swaps and flexible second-sourcing. Our complete in-house manufacturing control enables consistent quality while supporting standardized footprints that eliminate PCB redesigns. This approach reduces procurement risk and accelerates time-to-market.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Rapid engineering support and custom integration options further mitigate technical risks, ensuring seamless adoption of press-pack IGBTs in demanding applications. For more on securing supply chains and reducing supplier risk, see HIITIO\u2019s detailed&nbsp;<a href=\"https:\/\/www.hiitiosemi.com\/blog\/second-source-strategy-for-power-modules-to-cut-supplier-risk\/\">\u7b2c\u4e8c\u6765\u6e90\u7b56\u7565\u7528\u4e8e\u7535\u6e90\u6a21\u5757<\/a>.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Press-Pack Silicon vs. SiC in 2026<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">In 2026, I split this decision by system job, not by hype. For utility-grade builds, I start with HIITIO\u2019s&nbsp;<a href=\"https:\/\/www.hiitiosemi.com\/blog\/press-pack-igbt-vs-standard-modules-differences-performance-and-applications\/\">press-pack IGBT vs. standard modules comparison<\/a>&nbsp;\u548c&nbsp;<a href=\"https:\/\/www.hiitiosemi.com\/blog\/press-pack-vs-standard-power-modules-comparison-key-differences\/\">press-pack vs. standard power modules breakdown<\/a>&nbsp;because the real issue is fit, footprint control, and procurement risk.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Use Case Fit<\/h3>\n\n\n\n<figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><thead><tr><th>\u56e0\u7d20<\/th><th>Press-Pack Silicon IGBT<\/th><th>High-Voltage SiC MOSFET<\/th><\/tr><\/thead><tbody><tr><td>\u6700\u9002\u5408<\/td><td>HVDC transmission, STATCOM and FACTS, power grid infrastructure, rail traction, critical backup<\/td><td>Efficiency-focused converters where switching speed and power density matter most<\/td><\/tr><tr><td>What I value<\/td><td>Pin-compatible second-sourcing, stable footprint, strong thermal cycling reliability<\/td><td>Lower switching loss potential and compact power stages<\/td><\/tr><tr><td>Main risk<\/td><td>Not the first choice when the design goal is maximum switching frequency<\/td><td>Higher CapEx pressure and tighter material availability can raise sourcing risk<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<h3 class=\"wp-block-heading\">What I Look At<\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li>For&nbsp;renewable energy grid integration&nbsp;and&nbsp;power grid infrastructure, I lean toward press-pack silicon when reliability and service continuity matter more than chasing the smallest converter.<\/li>\n\n\n\n<li>For&nbsp;industrial rail traction systems&nbsp;and other hard-duty loads, press-pack IGBTs fit the kind of electrical stress and lifecycle risk I want to control.<\/li>\n\n\n\n<li>For&nbsp;power electronics procurement, I treat&nbsp;pin-compatible second-sourcing&nbsp;as an investment protection tool, not a nice-to-have.<\/li>\n\n\n\n<li>For&nbsp;PCB re-spin mitigation, a standardized press-pack footprint reduces redesign exposure and helps keep schedules intact.<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\">Cost vs. Capability<\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li>SiC&nbsp;can justify itself when the program is built around switching efficiency and high-power-density semiconductor goals.<\/li>\n\n\n\n<li>Press-pack silicon&nbsp;often wins when the priority is long-term supply stability, thermal cycling reliability, and less redesign risk.<\/li>\n\n\n\n<li>In my view, the smarter buy is the one that protects the platform, not just the first prototype.<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\">HIITIO View<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">HIITIO Semiconductor makes this easier to manage as a semiconductor power module manufacturer because it combines complete in-house manufacturing control, flexible topologies, and rapid engineering feedback. For projects where I need a practical second source, that mix matters more than headline specs alone.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Press-Pack IGBT FAQs for 2026<\/h2>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>What makes press-pack IGBTs better than wire-bond modules in high-voltage applications?<\/strong><br>I see the main advantage in the packaging itself. Press-pack designs use contact pressure instead of wire bonds, which supports stronger mechanical robustness, better thermal handling, and more stable performance in demanding power grid infrastructure. That matters in HVDC transmission, STATCOM and FACTS, rail traction systems, and other high-power density semiconductor use cases where reliability comes first. For a practical example, I would look at HIITIO\u2019s&nbsp;<a href=\"https:\/\/www.hiitiosemi.com\/product\/4500v-3000a-igbt-module-press-pack-package-with-fwd\/\">press-pack IGBT module with FWD<\/a>&nbsp;when evaluating this package style.<\/li>\n\n\n\n<li><strong>How does predictable fault behavior improve grid reliability?<\/strong><br>In utility and industrial systems, I care less about theory and more about what happens when stress goes up. A module with stable, predictable fault behavior is easier to protect, easier to qualify, and less likely to create a cascading system issue. That is why press-pack IGBTs are often treated as a serious option for critical power backup, HVDC transmission, and grid conversion work.<\/li>\n\n\n\n<li><strong>What market trends are driving press-pack IGBT adoption?<\/strong><br>The demand is coming from real projects, not hype: renewable energy grid integration, offshore and onshore wind, power conversion systems, EV infrastructure, and heavy-duty industrial applications. HIITIO positions press-pack IGBTs alongside other high-voltage power modules for these environments, including applications tied to&nbsp;<a href=\"https:\/\/www.hiitiosemi.com\/blog\/press-pack-igbts-for-hvdc-and-facts\/\">HVDC and FACTS systems<\/a>. That is where reliability, footprint compatibility, and fast engineering support matter most.<\/li>\n\n\n\n<li><strong>How can procurement reduce single-source risk?<\/strong><br>I would focus on three things: pin-compatible second-sourcing, flexible topologies, and a supplier with complete in-house manufacturing control. HIITIO emphasizes OEM swapping support and custom recommendations within 24 hours, which helps reduce PCB re-spin risk and keeps sourcing options open when a project has long qualification cycles.<\/li>\n\n\n\n<li><strong>When should engineers consider SiC instead of silicon press-pack IGBTs?<\/strong><br>I treat this as an application decision, not a marketing one. SiC is worth evaluating when switching speed, higher efficiency targets, or compact system design are the main priorities. Silicon press-pack IGBTs still make strong sense where the design needs proven high-voltage robustness, standardized footprints, and compatibility with established power grid and industrial rail traction systems.<\/li>\n\n\n\n<li><strong>What should I check before standardizing a press-pack platform?<\/strong><br>I would verify voltage class, topology, thermal requirements, footprint compatibility, and long-term sourcing support. HIITIO\u2019s catalog includes press-pack IGBTs, high-voltage IGBT modules, and related gate-driver hardware, so it is practical to align the module choice with the system architecture instead of forcing a redesign later.<\/li>\n<\/ul>\n\n\n\n<h2 class=\"wp-block-heading\">\u76f8\u5173\u6765\u6e90<\/h2>\n\n\n\n<ul class=\"wp-block-list\">\n<li><a href=\"https:\/\/pmc.ncbi.nlm\/\" target=\"_blank\" rel=\"noreferrer noopener\">https:\/\/pmc.ncbi.nlm<\/a><\/li>\n\n\n\n<li><a href=\"https:\/\/www.mdpi\/\" target=\"_blank\" rel=\"noreferrer noopener\">https:\/\/www.mdpi<\/a><\/li>\n\n\n\n<li><a href=\"https:\/\/www.osti.gov\/servlets\/purl\/921887\" target=\"_blank\" rel=\"noreferrer noopener\">https:\/\/www.osti.gov\/servlets\/purl\/921887<\/a><\/li>\n\n\n\n<li><a href=\"https:\/\/pmc.ncbi.nlm.nih.gov\/articles\/PMC12654587\/\" target=\"_blank\" rel=\"noreferrer noopener\">https:\/\/pmc.ncbi.nlm.nih.gov\/articles\/PMC12654587\/<\/a><\/li>\n<\/ul>","protected":false},"excerpt":{"rendered":"<p>Press-pack IGBTs are becoming a strategic choice for HVDC, renewable energy, rail traction, and industrial power systems in 2026. Learn how bond-wire-free architecture, double-sided cooling, standardized footprints, and second-source strategies improve reliability, reduce redesign risk, and strengthen long-term supply chain resilience.<\/p>","protected":false},"author":3,"featured_media":4335,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[32],"tags":[],"class_list":["post-5868","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-blog"],"blocksy_meta":[],"acf":[],"_links":{"self":[{"href":"https:\/\/www.hiitiosemi.com\/zh\/wp-json\/wp\/v2\/posts\/5868","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.hiitiosemi.com\/zh\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.hiitiosemi.com\/zh\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.hiitiosemi.com\/zh\/wp-json\/wp\/v2\/users\/3"}],"replies":[{"embeddable":true,"href":"https:\/\/www.hiitiosemi.com\/zh\/wp-json\/wp\/v2\/comments?post=5868"}],"version-history":[{"count":2,"href":"https:\/\/www.hiitiosemi.com\/zh\/wp-json\/wp\/v2\/posts\/5868\/revisions"}],"predecessor-version":[{"id":5891,"href":"https:\/\/www.hiitiosemi.com\/zh\/wp-json\/wp\/v2\/posts\/5868\/revisions\/5891"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.hiitiosemi.com\/zh\/wp-json\/wp\/v2\/media\/4335"}],"wp:attachment":[{"href":"https:\/\/www.hiitiosemi.com\/zh\/wp-json\/wp\/v2\/media?parent=5868"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.hiitiosemi.com\/zh\/wp-json\/wp\/v2\/categories?post=5868"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.hiitiosemi.com\/zh\/wp-json\/wp\/v2\/tags?post=5868"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}