IGBT & SiC Power Modules 650V – 6500V Factory Direct
High-performance semiconductor power modules for industrial drives, renewable energy, EV charging, and UPS systems. Full in-house manufacturing control — consistent quality, competitive pricing.
What Products We Offer For You
Six specialized module families covering standard to ultra-high voltage applications — all available for custom configuration.
SiC Module
Package: 62mm, Easy 1B, Easy 2B, Econo Dual 3A, Econo Dual 3B, Econo Dual 3C, Flow0, HPD
Circuit Diagram: ANPC, Boost, Chopper, Dual Boost, Three phase, H-Bridge, Half Bridge
Blocking Voltage (V): 1200, 1400, 1700, 2200
IGBT Module
Package: 34mm, 62mm, Easy 2B, Easy 3B, Econo Dual 3H, Econo PACK 2H, Econo PIM 2H, Econo PIM 3H
Circuit Diagram: Booster, Full-Bridge, 3-level, Three phase, Half Bridge, PIM, six-pack
Blocking Voltage (V): 650, 1000, 1100, 1200, 1700
High Voltage IGBT
Package:A/A2:190x140x48, E/E2:190x140x38, F/D:140x130x38, G:160x130x38, N/F/D:140x130x38, P:140x73x38, X:140x130x48, X1:144x100x40
Circuit Diagram: Chopper, Double switch, Half Bridge, Single Switch
Blocking Voltage (V): 1700, 2400, 3300, 4500, 6500
SiC/Si Hybrid Module
Package:Econo Dual 3A, Econo PACK 2H, Flow0, HPD
Circuit Diagram: ANPC, Dual Boost, Three phase, Half Bridge
Blocking Voltage (V): 1200
SiC Schottky Diode
Package: DFN8*8, SOT-227, TO-220-2, TO-220F-3, TO-247-2, TO-247-3, TO-247-4, TO-263-7
Blocking Voltage (V): 650, 1200, 1700
Current(A): 2,4,6,9,16,20,40,42,60,75,120
Custom Solution
We provide customized power module solutions with innovations like chip-embedded PCBs and double-sided heat dissipation, including Press Pack IGBTs rated up to 6500V/3000A for high-power applications, and IGBT & SiC Drivers with precise gate control and comprehensive protection.
Application
The modules are organized by module type, package type, and solution in the product filter interface of the page.
Power Conversion System
Reliable high-power performance for energy storage applications achieve ultra-low dynamic and static losses.
Renewable Energy Inverters
High-voltage IGBT devices enable efficient power conversion for wind turbines and solar inverters.
Industrial Motor Drives
Efficient control for VFDs, compressors, pumps, and factory automation equipment.
UPS Power Backup
Supports fast and stable switching for UPS and data center power systems.
Charging Station
Engineered for outdoor and public EV charging infrastructure..
Welding and Induction Heating
High-frequency switching for welding machines, induction heaters, and SMPS equipment.
Your Partner from Concept to Delivery
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wafer sawing
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Laser marking
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die attach
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automatic pin inserting
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Cu wire bound
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Case laser marking
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Case Assembly
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HTRB Testing
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Product testing
Core Capabilities & Advantages
HIITIO semiconductor power modules combine high efficiency, low loss, and reliable performance through advanced design and materials — with complete in-house manufacturing control.
Full In-House Manufacturing
From wafer sawing to final test — every step controlled in-house, eliminating supply chain risk and ensuring consistent quality batch to batch.
Wide Voltage Portfolio
Standard 650V IGBT modules through to ultra-high-voltage 6500V Press Pack IGBTs — one supplier for your full product range.
Custom & OEM Solutions
Tailored designs including chip-embedded PCBs, double-sided cooling, and custom gate drivers. NDA-friendly, small batches welcome.
100% Outgoing QC Testing
Every module undergoes HTRB stress testing and full electrical characterization before shipment — zero compromises on reliability.
Our Partners
We believe true partnerships go beyond transactions—they’re built on shared goals, engineering trust, and consistent performance. HIITIO provides the technology foundation that empowers our partners’ success.
What You Need to Know About Us
HIITIO® specializes in producing high-voltage DC power devices and semiconductor power modules geared toward electric vehicle, solar, and energy storage systems.
Founded in 2018 as a spin-off from Hecheng Electric, HIITIO has built a mature R&D team and refined manufacturing capabilities to serve the evolving needs of global power electronics markets.
With ISO 9001 certification and complete in-house production control, HIITIO serves 500+ clients across 50+ countries — providing both standard catalog modules and fully custom solutions.
ISO 9001 Certified Manufacturing
RoHS compliant · Traceable production · Full documentation
Trusted by Industry Customers Worldwide
FAQ
Can you cross-reference /replace Infineon, Semikron, orMitsubishi parts?
Yes. We offer cross-reference support for major brands including Infineon,Semikron, Mitsubishi, Fuji, Danfoss, and Wolfspeed. Share your current partnumber and we will confirm electrical and mechanical compatibility -typically within 24 hours.
Do you provide samples before bulk order?
Yes, we support sample orders for qualification and testing purposes.Sample lead time and pricing depend on the specific product – pleasecontact our sales team to arrange. Datasheet and test reports are availablebefore or alongside samples.
What certifications do your products carry?
Our manufacturing facility is ISO 9001 certified. Products are RoHScompliant. Full test reports, datasheets, and material declarations areavailable. For specific certification requirements (CE, UL, etc.) pleasediscuss with our engineering team.
Do you offer custom or OEM module design?
Absolutely. We offer full custom design services including chip selection,package layout, double-sided cooling, chip-embedded PCB substrates,and integrated gate drivers. NDA agreements are standard. Contact uswith your application requirements and target specifications.
HIITIO is a global provider of power semiconductor solutions, focusing on IGBT and SiC power modules for welding systems and industrial power conversion applications. With strong in-house engineering capabilities in module design, package platform development, thermal optimization, and application-oriented validation, we deliver high-reliability power modules that support stable and efficient operation in demanding industrial systems.
Optimized Welding Performance
Ultra-Low Switching Losses
Superior Thermal Management
Seamless Integration Support
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